Tongwei Co. Completes Fifth Green Sci-Tech Innovation Bond Issuance of 2026, Raising 500 Million Yuan

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Tongwei Co. has completed its fifth green sci-tech innovation bond issuance of 2026, with an actual total issuance of 500 million yuan. The bond has a maturity of 1+1 years, with an interest accrual date of July 14, 2026, and a redemption date of July 14, 2028. The coupon rate is 2.20 percent, and the issue price is 100 yuan per 100 yuan face value. The lead underwriter is China Merchants Bank, with joint lead underwriters China CITIC Bank and Bank of Tianjin. The raised funds were fully received on July 14.

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Tongwei Co Ltd
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Tongwei successfully issued a 500 million yuan green sci-tech innovation bond at a low 2.20% coupon rate, providing favorable financing.