Semiconductors▲
Inno Laser completes acceptance of first ultrafast laser drilling equipment order in IC substrate sector
Inno Laser disclosed on October 10 during an investor relations event that its ultrafast laser drilling equipment secured its first order in the IC substrate sector at the end of 2025, and completed acceptance in the first half of this year. The company said the equipment offers advantages such as customized lasers, independently designed optical systems, and fast iteration response. The equipment can meet precision drilling needs for substrate-like PCBs and various specifications of PCB, and customer validation is currently being accelerated.
About megatrends
Semiconductors › Interconnect & Passive Components ▲Technology
301021.CS · Demand · Positive Inno Laser secured its first ultrafast laser drilling equipment order in the IC substrate sector and completed customer acceptance, a concrete product order/adoption event.