Tower Semiconductor Ltd.

Tower Semiconductor and NewPhotonics announced high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits developed for next-generation AI infrastructure interconnect. The products are built on Tower's PH18DA silicon photonics platform, which uses heterogeneously integrated indium phosphide components to place semiconductor optical amplifiers, modulators, lasers, and photodetectors on a single chip, and the companies say the integration reduces complexity and manufacturing variability while improving yield, reliability and time to market. Volume production today covers data rates from 800G to 1.6T, with 6.4T solutions planned for future volume manufacturing to serve both scale-out and scale-up architectures, and shipment of the 6.4T NPC505 chipsets is anticipated during the first half of 2027. NewPhotonics is the first player across the market to scale up production on Tower's PH18DA InP-on-silicon photonics platform, and Tower faces execution risks in scaling alongside it, along with competition from alternative architectures and other silicon photonics foundries. Tower's stock has rallied 99.97% in 2026, lifting its market capitalization to $25.85 billion, with an operating margin of 19.63%, a net margin of 16.94%, a trailing price-to-earnings ratio of 91.11x, a forward P/E of 38.46x and a return on equity of 9.98%.