Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells integrated circuit (IC) products across Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and other international markets. Its services include chip probing and final testing, IC packaging such as wafer-level packaging, flip chips, wire bond BGA, lead frames, and system-in-package, as well as module assembly and quality management. The company is also involved in semiconductor design, manufacturing, assembly, testing, and sales, metal surface treatment on semiconductor wire frames, metal plating on semiconductor lead frames, and investment and wafer probing activities. It additionally offers IC assembly, burn-in, and system-level assembly. Incorporated in 1997, Powertech Technology Inc. is headquartered in Hsinchu City, Taiwan.