Teradyne Leads Semiconductor Manufacturing Stocks With Record Q2, Revenue Up 104%

BOE Technology stated on its investor interaction platform on October 10, in response to investor questions, that if the company's glass-based packaging substrate business reaches the conditions for a mass production decision, it will need to invest in building a new mass production line. Previously, investors had asked BOE Technology whether achieving mass production would require investing in a new production line, given that the company's glass substrates have already passed testing by multiple customers.

Dagang Co announced on the evening of October 9 that Beijing Xiaomi Smart Manufacturing Equity Investment Fund Partnership and Shanghai Semiconductor Materials Fund Phase II formed a consortium to acquire a 16% stake in Suzhou Keyang Semiconductor Co for 200 million yuan. The two parties each plan to contribute 100 million yuan to take an 8% stake, and the transaction still requires shareholder review and approval from state-owned assets authorities. Looking back, on July 30, 2026, Dagang Co's board approved its wholly owned subsidiary Jiangsu Keli Semiconductor Co to publicly list its 16% stake in Suzhou Keyang for transfer, with a reserve price of 200 million yuan. After the transfer, Keli Semiconductor will still hold a 12.56% stake in Suzhou Keyang. Dagang Co said that based on the transaction price, it can recover about 200 million yuan, with an estimated impact on current profit or loss of about 40 million yuan. Suzhou Keyang is not yet profitable at this stage, with a net loss of about 16 million yuan in the first half of this year. Regarding market expectations that Xiaomi is increasing its push into semiconductor packaging, a person close to Xiaomi Group told Securities Times reporters on October 10 that Xiaomi Group is only one of the investors and managers of Beijing Xiaomi Smart Manufacturing Equity Investment Fund Partnership, and this move cannot be equated with Xiaomi Group, nor does it represent a new strategic move by Xiaomi Group.

Nvidia is evaluating glass substrate packaging solutions and working with German equipment maker SCHMID and other companies to advance related equipment development. It also hopes panel makers in South Korea, Japan, and elsewhere can complete glass substrate development within two years. SCHMID disclosed in its earnings call that it is jointly developing glass substrate equipment with core companies in the supply chains of Nvidia, Intel, and AMD, but technical difficulties remain in the metallization step for through-glass vias, and customer certification has not yet been completed. According to TrendForce analysis, TSMC's CoPoS will focus on 310 by 310 millimeter substrate sizes in the near term. 2026 is a critical verification period for equipment and material suppliers, pilot production is expected in 2027, and formal mass production will begin in the second half of 2028. Li Wenqi, general manager of Shanghai Yibu Semiconductor, said TSMC originally planned to start mass production this year, but recent information shows it has been postponed to 2028. Domestically, BOE Chairman Chen Yanshun said the company is preparing to invest in a mass production line for semiconductor glass substrate carriers. Its 20-layer large-size glass substrate sample has passed six semiconductor-grade reliability tests and has been sent to leading domestic AI chip makers. Lens Technology's wholly owned subsidiary Lens International signed a memorandum of cooperation with Intel. Woge Optoelectronics' Hubei Phase One production line with annual capacity of 100,000 square meters of through-glass via substrates will complete certification with multiple customers in the first half of 2026 and enter small-batch supply. Triumph Science and Technology is investing 150 million yuan in Bengbu to build a pilot line for advanced packaging glass with through-glass vias. TCL Technology is investing 500 million yuan to establish Shenzhen Yunqi New Materials, in which it holds a 51 percent stake. On the equipment side, Delphi Laser's panel-level glass substrate via equipment has already begun shipping. S.C New Energy Technology's dedicated bubble cleaning equipment for through-glass via glass substrates and fully automatic hole-filling electroplating equipment have completed full-process testing and begun shipping.