SCHMID Group N.V. Class A Ordinary Shares

Nvidia is evaluating glass substrate packaging solutions and working with German equipment maker SCHMID and other companies to advance related equipment development. It also hopes panel makers in South Korea, Japan, and elsewhere can complete glass substrate development within two years. SCHMID disclosed in its earnings call that it is jointly developing glass substrate equipment with core companies in the supply chains of Nvidia, Intel, and AMD, but technical difficulties remain in the metallization step for through-glass vias, and customer certification has not yet been completed. According to TrendForce analysis, TSMC's CoPoS will focus on 310 by 310 millimeter substrate sizes in the near term. 2026 is a critical verification period for equipment and material suppliers, pilot production is expected in 2027, and formal mass production will begin in the second half of 2028. Li Wenqi, general manager of Shanghai Yibu Semiconductor, said TSMC originally planned to start mass production this year, but recent information shows it has been postponed to 2028. Domestically, BOE Chairman Chen Yanshun said the company is preparing to invest in a mass production line for semiconductor glass substrate carriers. Its 20-layer large-size glass substrate sample has passed six semiconductor-grade reliability tests and has been sent to leading domestic AI chip makers. Lens Technology's wholly owned subsidiary Lens International signed a memorandum of cooperation with Intel. Woge Optoelectronics' Hubei Phase One production line with annual capacity of 100,000 square meters of through-glass via substrates will complete certification with multiple customers in the first half of 2026 and enter small-batch supply. Triumph Science and Technology is investing 150 million yuan in Bengbu to build a pilot line for advanced packaging glass with through-glass vias. TCL Technology is investing 500 million yuan to establish Shenzhen Yunqi New Materials, in which it holds a 51 percent stake. On the equipment side, Delphi Laser's panel-level glass substrate via equipment has already begun shipping. S.C New Energy Technology's dedicated bubble cleaning equipment for through-glass via glass substrates and fully automatic hole-filling electroplating equipment have completed full-process testing and begun shipping.

SCHMID shares surged nearly 20% by Friday afternoon trading after a report revealed that advanced chipmakers were considering the use of glass substrates in processors. The technology could increase the amount of high-bandwidth memory in chips, boosting processing speeds for AI workloads. SCHMID Chief Sales Officer Roland Rettenmaier said on the company's second-quarter 2026 earnings call that many players in the Intel, Nvidia and AMD supply chains are eyeing glass core substrates for their flatness, smoothness, dielectric constants and signal integrity, and that the German-based company is engaged with most major supply chain players to make glass core substrates real. Nvidia CEO Jensen Huang recently met with the chairman of SK Group to discuss using glass substrate technology in next-generation semiconductors, according to Seoul Economic Daily, and has reportedly discussed it with TSMC as well. SCHMID specializes in high-tech manufacturing for electronics, photovoltaics, glass and energy systems, and has been developing glass substrate solutions that offer thinner, smoother packaging material to raise chip speeds and cut power consumption.

SCHMID Group N.V. reported second-quarter 2026 revenue of €27.7 million and raised its full-year order intake guidance to a range of €125 million to €150 million, up from approximately €114 million previously. The company recorded order intake of €30.7 million in the quarter, and including a repeat order exceeding €37 million announced on July 7, cumulative order intake since the beginning of the year reached €81.6 million. The order backlog stood at €54.8 million at the end of the quarter. Management maintained its full-year 2026 guidance of more than €100 million in revenue and an EBITDA margin above 12 percent.

SCHMID Group has agreed to raise $20 million through a private placement of senior convertible notes with an institutional investor. The notes carry a 5% annual interest rate, mature on January 14, 2029, and are convertible into the company's ordinary shares under terms outlined in the investment agreement. The company will use the net proceeds to fund working capital needs tied to accelerating order intake and to support expansion of its manufacturing capacity in China.