Lens Technology Co Ltd

Nvidia is evaluating glass substrate packaging solutions and working with German equipment maker SCHMID and other companies to advance related equipment development. It also hopes panel makers in South Korea, Japan, and elsewhere can complete glass substrate development within two years. SCHMID disclosed in its earnings call that it is jointly developing glass substrate equipment with core companies in the supply chains of Nvidia, Intel, and AMD, but technical difficulties remain in the metallization step for through-glass vias, and customer certification has not yet been completed. According to TrendForce analysis, TSMC's CoPoS will focus on 310 by 310 millimeter substrate sizes in the near term. 2026 is a critical verification period for equipment and material suppliers, pilot production is expected in 2027, and formal mass production will begin in the second half of 2028. Li Wenqi, general manager of Shanghai Yibu Semiconductor, said TSMC originally planned to start mass production this year, but recent information shows it has been postponed to 2028. Domestically, BOE Chairman Chen Yanshun said the company is preparing to invest in a mass production line for semiconductor glass substrate carriers. Its 20-layer large-size glass substrate sample has passed six semiconductor-grade reliability tests and has been sent to leading domestic AI chip makers. Lens Technology's wholly owned subsidiary Lens International signed a memorandum of cooperation with Intel. Woge Optoelectronics' Hubei Phase One production line with annual capacity of 100,000 square meters of through-glass via substrates will complete certification with multiple customers in the first half of 2026 and enter small-batch supply. Triumph Science and Technology is investing 150 million yuan in Bengbu to build a pilot line for advanced packaging glass with through-glass vias. TCL Technology is investing 500 million yuan to establish Shenzhen Yunqi New Materials, in which it holds a 51 percent stake. On the equipment side, Delphi Laser's panel-level glass substrate via equipment has already begun shipping. S.C New Energy Technology's dedicated bubble cleaning equipment for through-glass via glass substrates and fully automatic hole-filling electroplating equipment have completed full-process testing and begun shipping.

Lens Technology announced that the share increase plan of Qunxin Company, controlled by the company's actual controllers Zhou Qunfei and Zheng Junlong, has been completed. Qunxin Company increased its holdings by a total of 3.1055 million shares, accounting for 0.06% of the total share capital, with an increase amount of about 100 million yuan. After the increase, Qunxin Company's shareholding ratio rose from 5.38% to 5.44%.

On August 5, the consumer electronics sector rose 3.18% intraday, with Zhidongli up 20.00%, Boshuo Technology up 15.52%, Universal Scientific Industrial up 10.00%, Litong Electronics up 10.00%, and Bird shares up 9.92%. According to Shanghai Securities News, as August begins, the consumer electronics market enters a new product launch season, driven primarily by Apple's next-generation products. The entire Apple supply chain is accelerating recruitment, with leading contract manufacturers like Foxconn continuously expanding engineering positions. Companies such as Lens Technology and Jingyan Technology have already entered critical stages of research and development, capacity expansion, and mass production delivery. A research report from Wanlian Securities noted that in the first quarter of 2026, the consumer electronics sector's revenue grew 33.65% year-on-year, and net profit attributable to the parent company rose 44.40% year-on-year. However, performance within the sector diverged significantly, with companies closely tied to AI computing power performing better, while those with a larger share of consumer electronics main business still face cost pressures. Looking ahead, as major companies launch new products and AI-enabled terminals continue to gain traction, replacement demand is expected to be stimulated. A research report from Guojin Securities pointed out that the 3C accessories industry continues to tap growth potential through new material applications and functional innovations. Relevant new regulations are expected to be implemented in 2026, which will accelerate the exit of small and medium-sized players and promote industry consolidation.

Intel Corporation has partnered with Lens Technology to develop advanced glass substrate packaging for semiconductor chips, aiming to improve performance and power efficiency for AI, data center, and high-performance computing applications. Under the agreement, Intel will contribute its semiconductor architecture and packaging expertise while Lens Technology provides precision glass processing and large-scale manufacturing capabilities. The collaboration will also explore opportunities in AI PCs, robotics, industrial equipment, and edge computing. Intel shares have surged 343.3% over the past year, and the stock currently holds a Zacks Rank of 1, or Strong Buy.

Lens Technology and Intel have officially signed a cooperation memorandum, with both parties focusing on joint innovation in glass substrate advanced packaging technology. According to the announcement, the two sides will collaborate on through-glass via technology. Intel regards Lens Technology as a valuable potential partner in this field and will provide illustrative architecture information, design for manufacturability guidelines, benchmarking methods, and validation methods. Beyond through-glass via, the two parties will also explore cooperation in areas such as AI PC structural components and modules, data center server structural components and thermal components, embodied intelligent robots, industrial smart devices, and edge computing hardware. Lens Technology already has long-term technical accumulation in processes such as through-glass via precision processing, micro-hole formation, metallization deposition, and multi-layer interconnection, and has established a relevant pilot line, having already sent samples to some potential customers for evaluation. The company plans to construct a dedicated through-glass via glass substrate factory building with a floor area of 30,000 square meters and a full set of supporting production lines, with the project expected to officially start production by the end of 2026.

On the evening of July 24, several listed companies released positive announcements. CATL disclosed its 2026 semi-annual report, with first-half revenue reaching 276.917 billion yuan, up 54.8 percent year-on-year, and net profit attributable to the parent company of 43.284 billion yuan, up 41.98 percent year-on-year. It also plans to distribute a cash dividend of 14.11 yuan per 10 shares. At the same time, the company announced plans to buy back shares worth 20 billion to 40 billion yuan for cancellation and reduction of registered capital, with a maximum repurchase price of 573 yuan per share. Hikvision reported first-half revenue of 46.823 billion yuan, up 11.97 percent year-on-year, and net profit attributable to the parent company of 7.896 billion yuan, up 39.57 percent year-on-year, and plans to distribute a cash dividend of 5.5 yuan per 10 shares. Lens Technology's wholly-owned subsidiary, Lens International Hong Kong Limited, signed a memorandum of cooperation with Intel, with both parties focusing on TGV advanced packaging as a key discussion area. Sunwoda's subsidiary, Sunwoda Power, plans to introduce Sungrow and Tianqi Lithium Shehong Limited to jointly invest 805 million yuan for a capital increase. After the capital increase, Sunwoda's stake in Sunwoda Power will decrease from 27.18 percent to 26.38 percent, while retaining control. TCL Technology's acquisition of a 45 percent stake in Guangzhou Huaxing Semiconductor was approved by the Shenzhen Stock Exchange. Upon completion, TCL Technology will directly and indirectly hold 100 percent of Guangzhou Huaxing Semiconductor. In the first half, Guangzhou Huaxing Semiconductor achieved revenue of 7.926 billion yuan and net profit of 1.154 billion yuan, up 203.99 percent year-on-year. In addition, Sany Heavy Industry plans to buy back shares worth 400 million to 800 million yuan for an employee stock ownership plan. Rongda Photosensitive plans a private placement to raise no more than 591 million yuan. Dongfang Electronics plans to invest 2.47 billion yuan to build a smart energy innovation industrial park. Xiamen Tungsten plans to invest 26.5174 million yuan to acquire a 1.3483 percent stake in Jiangxi Jutong to enhance tungsten resource security. Dongcai Technology's project with an annual output of 20,000 tons of electronic materials for high-speed communication substrates is in the trial production stage. Demingli's controlling shareholder and chairman, Li Hu, has committed not to reduce his shareholding in the company within 12 months.

General-purpose humanoid robot company LimX Dynamics announced the completion of its Pre-IPO financing round, raising nearly 200 million US dollars, with a post-investment valuation of 15 billion yuan. The company has raised a total of 400 million US dollars over the past six months. Investors in this round include IDG Capital, Lens Technology, GGG Group and Redstone VC, WestSummit Capital, and Hefei Binhu Industrial Development Group. Founded in 2022, LimX Dynamics focuses on full-size humanoid robots and has secured thousands of orders, more than half of which are from overseas. In May this year, it released the full-size interactive humanoid robot LimX Luna and has already delivered units to domestic and international customers. In addition, Lens Technology also participated in the Series B financing of another embodied intelligence company, CrossWise AI, which raised 1 billion yuan, with a post-investment valuation exceeding 10 billion yuan, and is set to launch its IPO soon.

China's first ultrasound brain-computer interface company Gestalt Tech has completed a 420 million yuan angel+ round of financing. This round was led by Huaying Capital, with follow-on investments from C Capital, Sequoia China, Lens Technology, China Electronics Health Fund, Sinovation Ventures, Lingang Sci-Tech Innovation Investment, Fudan Furong Capital, and Guotai Venture Capital, among other leading domestic and international investment institutions. Existing shareholders including Daotong Investment, Yunshi Capital, Qingsong Capital, and Gobi Partners continued to oversubscribe. China Renaissance acted as the exclusive financial advisor. At the same time, Gestalt Tech's Shanghai headquarters in the Brain Intelligence Park in Minhang District was officially inaugurated. As of 14:18 on July 3, 2026, the Shanghai Stock Exchange STAR Biomedical Index rose strongly by 2.69 percent. Among constituent stocks, MGI Tech rose 14.97 percent, Dizal Pharmaceutical rose 10.77 percent, and Olym Biotech rose 8.82 percent, with stocks like Youcare Pharmaceutical and Yundong Biotech also rising. The STAR Medical ETF Huaxia rose 2.17 percent, heading for a fifth consecutive gain, with the latest price at 1.08 yuan. CICC believes that innovative fields represented by AI plus healthcare and brain-computer interfaces are experiencing rapid development, with systems from supporting policies to capital support gradually improving, and such directions may present structural investment opportunities.