Nvidia is evaluating glass substrate packaging solutions and working with German equipment maker SCHMID and other companies to advance related equipment development. It also hopes panel makers in South Korea, Japan, and elsewhere can complete glass substrate development within two years. SCHMID disclosed in its earnings call that it is jointly developing glass substrate equipment with core companies in the supply chains of Nvidia, Intel, and AMD, but technical difficulties remain in the metallization step for through-glass vias, and customer certification has not yet been completed. According to TrendForce analysis, TSMC's CoPoS will focus on 310 by 310 millimeter substrate sizes in the near term. 2026 is a critical verification period for equipment and material suppliers, pilot production is expected in 2027, and formal mass production will begin in the second half of 2028. Li Wenqi, general manager of Shanghai Yibu Semiconductor, said TSMC originally planned to start mass production this year, but recent information shows it has been postponed to 2028. Domestically, BOE Chairman Chen Yanshun said the company is preparing to invest in a mass production line for semiconductor glass substrate carriers. Its 20-layer large-size glass substrate sample has passed six semiconductor-grade reliability tests and has been sent to leading domestic AI chip makers. Lens Technology's wholly owned subsidiary Lens International signed a memorandum of cooperation with Intel. Woge Optoelectronics' Hubei Phase One production line with annual capacity of 100,000 square meters of through-glass via substrates will complete certification with multiple customers in the first half of 2026 and enter small-batch supply. Triumph Science and Technology is investing 150 million yuan in Bengbu to build a pilot line for advanced packaging glass with through-glass vias. TCL Technology is investing 500 million yuan to establish Shenzhen Yunqi New Materials, in which it holds a 51 percent stake. On the equipment side, Delphi Laser's panel-level glass substrate via equipment has already begun shipping. S.C New Energy Technology's dedicated bubble cleaning equipment for through-glass via glass substrates and fully automatic hole-filling electroplating equipment have completed full-process testing and begun shipping.
SCHMID disclosed it is jointly developing glass substrate equipment with Nvidia, Intel and AMD supply chains, though metallization and customer certification remain unresolved.
Intel is named as a supply-chain partner in SCHMID's glass substrate equipment work and Lens Technology signed an MOU with Intel, but no concrete Intel-specific outcome is given.
Nvidia is evaluating glass substrate packaging and pushing SCHMID and panel makers to advance the equipment, a technology development for its packaging roadmap.
BOE is preparing to invest in a semiconductor glass substrate carrier mass production line, with its 20-layer large-size sample passing six reliability tests and sent to leading domestic AI chip makers.
Woge Optoelectronics' through-glass via substrate line will complete certification in H1 2026 and enter small-batch supply, a supply-chain development for glass substrates.
GlobalFoundries Unveils FDX Fusion Physical AI Platform in Dresden
GlobalFoundries announced FDX Fusion, a next-generation FD-SOI platform to be developed and manufactured in Dresden for highly integrated, energy-efficient Physical AI chips spanning sensing, compute, control and connectivity functions. The platform blends seven nanometer class digital performance with advanced RF, analog and embedded memory on a single chip aimed at edge and automotive, industrial and consumer AI systems. The launch fits GlobalFoundries' broader shift away from weaker smart mobile demand toward automotive, industrial, communications and AI applications, though it does not immediately change the near term risk that higher investment and oversubscribed niches like SiGe could still coexist with only high 80s percent fab utilization. Among recent announcements, a US$2 billion, five year silicon interposer deal with TSMC reinforces GlobalFoundries' role in AI hardware supply alongside FDX Fusion, with the Dresden FDX roadmap and Malta advanced packaging capacity sitting squarely against the key catalyst of moving its revenue mix toward higher value, AI linked processes. GlobalFoundries' narrative projects $10.4 billion revenue and $1.7 billion earnings by 2029, requiring 14.5% yearly revenue growth and a roughly $1.0 billion earnings increase from $716.0 million today, while the most optimistic analysts already assumed about US$11.7 billion of revenue and US$2.3 billion of earnings by 2029.
TSMC Posts Record Q3 2026 Revenue on AI Chip Demand
Taiwan Semiconductor Manufacturing reported record Q3 2026 revenue of about NT$1.49t, with September alone at NT$511.86b, driven by demand for chips used in AI workloads. Management highlighted advanced packaging services for AI accelerators as a key contributor to the quarter, and said leading edge capacity is fully booked through 2026. TSMC also agreed a multi year, US$2b silicon interposer supply arrangement with GlobalFoundries that includes the first U.S.-based silicon interposer production for its packaging, extending its CoWoS packaging supply chain into the United States and spreading manufacturing risk. The company is supporting a US$64b capex plan, and investors will watch whether it can ease advanced packaging constraints and how much of that spend translates into stable utilization and revenue progress through and after the Malta ramp toward 2028.
BOE Technology Responds: Mass Production of Glass-Based Packaging Substrates Requires New Production Line Investment
BOE Technology stated on its investor interaction platform on October 10, in response to investor questions, that if the company's glass-based packaging substrate business reaches the conditions for a mass production decision, it will need to invest in building a new mass production line. Previously, investors had asked BOE Technology whether achieving mass production would require investing in a new production line, given that the company's glass substrates have already passed testing by multiple customers.
Semiconductors › Advanced Packaging & Test (OSAT) Supply
000725.CS · Capital · Neutral BOE says mass production of glass-based packaging substrates would require investing in a new production line, a capex decision contingent on future conditions.
Musk's Terafab to Begin Mass Production in Texas by 2032
Plans emerged on the 9th that Terafab, the semiconductor manufacturing initiative launched by American businessman Elon Musk, aims to have a large-scale mass production plant operating in Texas by 2032. According to people familiar with the matter, preparations are underway to start up a semiconductor pilot plant in the state during 2027, and orders have already begun to be placed with Japanese semiconductor manufacturing equipment and materials companies for the pilot plant. The plant is expected to be completed as early as July 2027 and to begin operating within that year. At the large-scale mass production plant targeted for operation in 2032, production of logic semiconductors capable of advanced computing and memory will be handled at a single facility, with final production scale projected at roughly 1 million wafers per month, of which about 70 percent of capacity will be allocated to memory and about 30 percent to logic. The production scale will be comparable to the large-scale plants of major semiconductor makers such as Taiwan Semiconductor Manufacturing and South Korea's Samsung Electronics. For logic semiconductor production, Intel of the United States will provide technical cooperation, with adjustments underway to adopt the company's 2-nanometer and 1.4-nanometer circuit linewidth technologies, while for memory manufacturing a plan has surfaced for a Taiwanese company to provide technical cooperation. Terafab is an initiative announced by Musk in March, under which the electric vehicle giant Tesla and space development company SpaceX will lead the development of semiconductor plants, investing 55 billion dollars initially, with total investment potentially expanding to 119 billion dollars including additional portions.
SPCX · Capital · Positive SpaceX is named as co-lead of the Terafab semiconductor initiative, which involves $55B initial and up to $119B total investment.
TSLA · Capital · Positive Tesla is named as co-lead of the Terafab semiconductor initiative, which involves $55B initial and up to $119B total investment.
INTC · Technology · Positive Intel will provide technical cooperation for Terafab's logic production, with its 2nm and 1.4nm technologies to be adopted.
005930.KO · Competition · Neutral Samsung is only cited as a comparison for Terafab's planned production scale, not as a participant.
2330.TW · Competition · Neutral TSMC is only cited as a comparison for Terafab's planned production scale, not as a participant.
Tower Semiconductor and NewPhotonics Begin High-Volume Shipments of Optical Engine PICs for AI Interconnect
Tower Semiconductor and NewPhotonics announced high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits developed for next-generation AI infrastructure interconnect. The products are built on Tower's PH18DA silicon photonics platform, which uses heterogeneously integrated indium phosphide components to place semiconductor optical amplifiers, modulators, lasers, and photodetectors on a single chip, and the companies say the integration reduces complexity and manufacturing variability while improving yield, reliability and time to market. Volume production today covers data rates from 800G to 1.6T, with 6.4T solutions planned for future volume manufacturing to serve both scale-out and scale-up architectures, and shipment of the 6.4T NPC505 chipsets is anticipated during the first half of 2027. NewPhotonics is the first player across the market to scale up production on Tower's PH18DA InP-on-silicon photonics platform, and Tower faces execution risks in scaling alongside it, along with competition from alternative architectures and other silicon photonics foundries. Tower's stock has rallied 99.97% in 2026, lifting its market capitalization to $25.85 billion, with an operating margin of 19.63%, a net margin of 16.94%, a trailing price-to-earnings ratio of 91.11x, a forward P/E of 38.46x and a return on equity of 9.98%.
TSEMI03.BK · Demand · Positive High-volume shipments of Tower's PH18DA silicon photonics optical engine PICs for AI interconnect mark real product adoption.
NewPhotonics · Demand · Positive NewPhotonics is first to scale volume production of its optical engine PICs on Tower's PH18DA platform, with 6.4T NPC505 chipsets shipping in H1 2027.
TSEMI23.BK · Competition · Negative Article flags execution risks in scaling and competition from alternative architectures and other silicon photonics foundries.
TSEMI80.BK · Capital · Neutral Stock rallied 99.97% in 2026 with rich valuation metrics, but no new company-specific financial event.
ASML Set to Report Q3 Fiscal 2026 Earnings on Oct. 14
ASML Holding N.V. is scheduled to report third-quarter fiscal 2026 earnings on Oct. 14, before market open, with the Zacks Consensus Estimate pegged at $13.18 billion in sales and $12.47 per share. The company has delivered a four-quarter earnings surprise of 3.91%, on average, and its Earnings ESP of +4.49% with a Zacks Rank #3 points to a likely earnings beat. During the quarter, ASML announced a collaboration with Xanadu Quantum Technologies Limited to advance lithography processes for photonic quantum hardware, expanded its strategic partnership with Samsung Electronics in High-NA EUV lithography, began construction of a second major industrial campus in the Brainport region of the Netherlands expected to cover approximately 350,000 square meters and accommodate up to 20,000 workplaces, and extended its collaboration with Intel, whose Panther Lake production uses ASML's High NA EUV lithography. Management expects 2026 advanced foundry Logic revenues to rise about 25%, Memory revenue to increase 75%, EUV revenues to grow roughly 45%, and DUV, metrology and inspection revenue to increase about 25%, with customer commitments extending into 2027 and 2028. China is expected to account for roughly 20% of 2026 sales, leaving ASML exposed to changes in export restrictions, while the stock trades at a forward price-to-sales ratio of 11.74 versus the industry average of 11.11.
ASML.AS · Capital · Positive ASML is set to report Q3 fiscal 2026 earnings with consensus estimates and a likely earnings beat (positive ESP, Zacks Rank #3)
ASML.AS · Demand · Positive Management expects strong 2026 revenue growth across Logic, Memory, EUV and DUV with customer commitments extending into 2027-2028
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