ASML and TSMC Partner to Adapt High NA EUV Tools for Larger AI Chips

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ASML Holding N.V. plans to work with major customers including Taiwan Semiconductor Manufacturing Company Limited, Nvidia, Intel, Samsung, and SK Hynix to adapt its next-generation High NA extreme ultraviolet lithography tools so they can print larger data-center chips, addressing a current limitation where the newer machines use a smaller mask than ASML's widely deployed standard EUV tools. ASML targets a pilot production line using the larger masks by 2031 and high-volume manufacturing readiness by 2033, with Chief technology officer Marco Pieters saying the changes could lift system productivity by roughly 40%. TSMC plans to introduce High NA EUV into advanced-node high-volume production from 2030, giving ASML greater visibility into future equipment demand. The larger-mask transition carries execution risks, as ASML must develop and qualify larger masks while TSMC must integrate the technology into high-volume manufacturing, and the benefits remain several years away from contributing to either company's financial results. Hedge fund ownership of ASML grew to 140 funds in the second quarter from 133 in the first, with combined position value rising to $21.77 billion from $16.38 billion, while TSMC's hedge fund ownership grew to 249 funds from 234.

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Semiconductors › Lithography Systems ▲Technology
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ASML.AS · Capital · Positive ASML is set to report Q3 fiscal 2026 earnings with consensus estimates and a likely earnings beat (positive ESP, Zacks Rank #3)
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