Summary of announcements by Shanghai and Shenzhen listed companies on the evening of September 24: Sanan Optoelectronics' actual controller Lin Xiucheng detained; Hengtong Optoelectronics plans private placement to raise no more than 6.636 billion yuan
On the evening of September 24, multiple listed companies on the Shanghai and Shenzhen stock exchanges issued major announcements. Sanan Optoelectronics announced that it had received notice from the family of its actual controller Lin Xiucheng that Lin had been criminally detained by public security authorities on suspicion of embezzlement of his position and misappropriation of funds. Lin has not held any position in the company since July 10, 2017, and the company said the matter is unrelated to the company and will not have a material impact on production and operations. Hengtong Optoelectronics plans to issue shares to specific investors to raise no more than 6.636 billion yuan, for projects including research and production of next-generation optical fiber, construction of high-end optical new materials in Inner Mongolia, and research and development of advanced CPO packaging. Guanghuan Xinwang plans to make an additional investment of no more than 1.265 billion yuan in the Helinger intelligent computing center project, bringing total project investment to approximately 2.5 billion yuan and raising IT load capacity from 60 to 100 megawatts to 90 to 120 megawatts. China Life Insurance plans to subscribe for capital contributions of no more than 4.5 billion yuan in a partnership with total subscriptions of no more than 6 billion yuan, focusing on high-quality unlisted equity in the artificial intelligence and semiconductor sectors. Shandong Gold Mining has adjusted its 2026 gold production plan from no less than 49 tonnes to between 36 and 38 tonnes. The company's mined gold output in 2025 was 48.89 tonnes, and net profit attributable to the parent is expected to decline year on year in 2026. In addition, Zhongji Innolight completed a buyback of 5.6531 million shares for 4.997 billion yuan, Jifeng Auto Parts' controlling subsidiary received a nomination for a passenger car seat assembly project with an estimated total life-cycle value of 9.2 billion yuan, and EVE Energy plans to transfer a 45 percent stake in Hubei Enjie New Materials for 1.15 billion yuan.
Tower Semiconductor and NewPhotonics Begin High-Volume Shipments of Optical Engine PICs for AI Interconnect
Tower Semiconductor and NewPhotonics announced high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits developed for next-generation AI infrastructure interconnect. The products are built on Tower's PH18DA silicon photonics platform, which uses heterogeneously integrated indium phosphide components to place semiconductor optical amplifiers, modulators, lasers, and photodetectors on a single chip, and the companies say the integration reduces complexity and manufacturing variability while improving yield, reliability and time to market. Volume production today covers data rates from 800G to 1.6T, with 6.4T solutions planned for future volume manufacturing to serve both scale-out and scale-up architectures, and shipment of the 6.4T NPC505 chipsets is anticipated during the first half of 2027. NewPhotonics is the first player across the market to scale up production on Tower's PH18DA InP-on-silicon photonics platform, and Tower faces execution risks in scaling alongside it, along with competition from alternative architectures and other silicon photonics foundries. Tower's stock has rallied 99.97% in 2026, lifting its market capitalization to $25.85 billion, with an operating margin of 19.63%, a net margin of 16.94%, a trailing price-to-earnings ratio of 91.11x, a forward P/E of 38.46x and a return on equity of 9.98%.
TSEMI03.BK · Demand · Positive High-volume shipments of Tower's PH18DA silicon photonics optical engine PICs for AI interconnect mark real product adoption.
NewPhotonics · Demand · Positive NewPhotonics is first to scale volume production of its optical engine PICs on Tower's PH18DA platform, with 6.4T NPC505 chipsets shipping in H1 2027.
TSEMI23.BK · Competition · Negative Article flags execution risks in scaling and competition from alternative architectures and other silicon photonics foundries.
TSEMI80.BK · Capital · Neutral Stock rallied 99.97% in 2026 with rich valuation metrics, but no new company-specific financial event.
Openreach Deploys Ciena's 1.6Tb/s Waveserver Platform in OSEA Rollout
Openreach is deploying Ciena's Waveserver platform, powered by WaveLogic 6 1.6Tb/s coherent technology, as part of its Optical Spectrum Extended Access portfolio. The deployment combines 400G and 800G client traffic over dedicated 1.6Tb/s wavelengths, with a compact 2RU chassis supporting up to 32 400G services, and enables Openreach to introduce national 800G services across the U.K. while providing a pathway to higher speeds. The solution will let Openreach offer wholesale customers tailored, high-capacity network services including connectivity for cable landing stations, data centers and core network nodes. Ciena faces competition from Corning, which announced a long-term partnership with NVIDIA to expand U.S.-based optical connectivity manufacturing capacity by 10 times and increase domestic fiber production capacity by more than 50%, and from Nokia, whose Network Infrastructure unit delivered double-digit growth in second-quarter 2026. Ciena shares have gained 27.3% in the past month, and the Zacks Consensus Estimate for its fiscal 2026 earnings has been revised upward over the past 60 days.
CIEN · Demand · Positive Openreach is deploying Ciena's Waveserver/WaveLogic 6 1.6Tb/s platform in its OSEA rollout, a concrete customer win.
GLW · Competition · Neutral Corning is cited only as a Ciena competitor via its NVIDIA optical-connectivity manufacturing partnership, not as a subject of the news.
NOK · Competition · Neutral Nokia is mentioned only as a competitor whose Network Infrastructure unit posted double-digit Q2 2026 growth.
Guangzhi Technology Secures Order from Global Leading Customer for 6-Inch Indium Phosphide Substrates
Guangzhi Technology stated on an investor interaction platform on October 9 that its downstream customers for indium phosphide substrate business are domestic and overseas optical communication chip and device manufacturers, and batch deliveries have been achieved to date. The company said its domestic customers cover leading optical chip enterprises, and it has shipped in volume to leading optical communication firms overseas. Among these, the 6-inch indium phosphide substrate has secured an order from a certain global leading customer.
Tianfu Communication Responds to Rumors of Overseas Import and Export Policy Restrictions: Optical Device Products Not Affected
Tianfu Communication released an investor relations activity record announcement, responding to recent rumors about overseas import and export policy restrictions. The company stated that the policies issued so far do not impose constraints on optical device products and do not affect its business. The company said its main business is the research, development, production, and sales of various passive and active optical devices. Its sales revenue from the U.S. market accounts for a relatively low proportion, with North American sales revenue making up about 1.28% of total operating revenue in 2025. Based on current operations, the company's orders on hand and customer demand remain robust overall, and it will advance global capacity expansion in an orderly manner according to market demand and customer project timelines. The company remains optimistic about the long-term prospects of the optical interconnect industry, especially the continued growth opportunities in areas such as CPO and NPO. In addition, the company's FAU and ELS products supporting CPO already have a solid foundation in performance, yield, and delivery assurance, and these products have achieved stable mass production and delivery.
Artificial Intelligence › AI Networking & Interconnect ▲Regulation
300394.CS · Regulation · Positive Company states overseas import/export policy restrictions do not affect its optical device products, removing a regulatory overhang on its business.
Arista Unveils Open Ethernet Rack-Scale Portfolio for AI Infrastructure
Arista Networks has unveiled a new open Ethernet rack-scale portfolio designed to support high-density artificial intelligence infrastructure across both scale-up and scale-out environments, developed with AMD, Arm, Broadcom, d-Matrix, Meta, Microsoft and Qualcomm. The company's Etherlink SU-14 architecture extends Ethernet into scale-up environments, supporting up to 144 accelerators in a single rack and up to 1,024 XPUs through cross-rack configurations. For scale-out AI environments, the rack-scale solutions support technologies such as ESUN, NVIDIA's NVLink, NVLink Fusion and PCIe, built on Arista's Netdi foundation using Ultra Ethernet Consortium standards. The rack designs integrate liquid-cooled 7060EX7 switches with up to 102.4 Tbps of capacity per switch, and the company's next-generation optics, including XPO and open CPO/NPO, can raise networking capacity from 1.6 Pb/s to 6.5 Pb/s per rack compared with current OSFP-based switches. Arista faces competition from Cisco Systems, which is expanding its AI infrastructure business through its Secure AI Factory with NVIDIA, and from NVIDIA, which is advancing its Vera Rubin platform and developing Spectrum-6 Ethernet.
ANET · Technology · Positive Arista unveiled a new open Ethernet rack-scale portfolio (Etherlink SU-14, 7060EX7 switches, XPO/CPO optics) for high-density AI infrastructure.
Credo Technology Joins Open CPX MSA Co-Packaged Optics Consortium
Credo Technology Group Holding Ltd. has joined the Open Co-packaged Interface Multi-Source Agreement, or Open CPX MSA, a consortium working to advance interoperable near-package and co-packaged optics architectures for AI networking. As a member, Credo will contribute its optical DSPs, silicon photonics-based integrated circuits and other components to support the standard, which released its initial specification on September 17, 2026, defining interoperable co-packaged and near-package optical modules supporting connectivity of up to 7.2 Tbps per socket. The company also recently completed testing of its Toucan Gen6x16 PCI Express retimer, which has been added to the PCI-SIG Integrators List. Credo shares have returned 51.95% year to date, and as of October 7 the stock traded at a trailing price-to-earnings multiple of approximately 77.70x and a forward P/E of 30.19x. By the end of Q2 2026, 86 hedge funds held positions in the stock, up from 59 in Q1 2026, with BlackRock the largest institutional owner at 17.76 million shares, or 9.45% of outstanding shares.