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AMD CEO Lisa Su Says Chip Demand Outruns Supply, Plans Capacity Years Ahead
Advanced Micro Devices CEO Lisa Su said chip demand remains ahead of supply and expects it to stay very high for the next several years, speaking to reporters in Taipei on October 6. Su said AMD has increased supply through 2026 and plans a much bigger jump in 2027, with capacity now planned three to five years ahead. Her Asia trip included meetings with Foxconn and TSMC, followed by talks with memory makers in South Korea, as AI chips depend on large amounts of memory that constrain how many AMD can ship. Stifel raised its AMD target to $700 on October 5, arguing AI buildouts are limited by chip supply. AMD's forward non-GAAP P/E of 83.38x and forward price-to-sales ratio of 20.25x both sit at more than double their 5-year averages, while analysts expect EPS to rise about 82% in 2026, 107% in 2027 and 45% in 2028.
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Artificial Intelligence › AI Compute & Accelerator Silicon ▲Supply
Artificial Intelligence › HBM & AI Memory Supply
Artificial Intelligence › Foundry & Advanced Packaging ▲Supply
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Intel and Applied Materials Expand AI Chipmaking Partnership
Applied Materials and Intel announced on October 6 that they are expanding their partnership on next-generation AI chipmaking, working together on transistors, the wiring that connects them, and advanced packaging, including Intel's Foveros technology for stacking chips in 3D. Teams will work out of Applied's EPIC Center in Silicon Valley and Intel's research campus in Oregon, with Intel CEO Lip-Bu Tan saying the goal is to move new technology from the lab into high-volume U.S. production faster. Intel CFO Dave Zinsner has said packaging can reach 40% gross margins, and some deals could be worth billions of dollars a year, though industry reports linking Intel to potential advanced packaging deals with major cloud customers have not been publicly confirmed. Intel trades at a forward non-GAAP P/E of 73.94x, about 20% above its 5-year average, and a forward price-to-sales ratio of 9.37x versus an average of 3.17x, while carrying about $21 billion in net debt. Applied Materials trades at a forward non-GAAP P/E of 41.47x and a forward price-to-sales ratio of 12.29x, and unlike Intel it is net cash positive, with management expecting packaging revenue to grow more than 70% in calendar 2026.
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Artificial Intelligence › Foundry & Advanced Packaging ▲Technology
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INTC · Technology · Positive Intel expands partnership with Applied Materials on next-gen AI chipmaking including Foveros 3D stacking, aiming to move new technology into high-volume U.S. production faster.
AMAT · Demand · Positive Applied Materials expands AI chipmaking partnership with Intel, working on transistors, wiring, and advanced packaging, with management expecting packaging revenue to grow over 70% in 2026.
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GlobalFoundries Unveils FDX Fusion Physical AI Platform in Dresden
GlobalFoundries announced FDX Fusion, a next-generation FD-SOI platform to be developed and manufactured in Dresden for highly integrated, energy-efficient Physical AI chips spanning sensing, compute, control and connectivity functions. The platform blends seven nanometer class digital performance with advanced RF, analog and embedded memory on a single chip aimed at edge and automotive, industrial and consumer AI systems. The launch fits GlobalFoundries' broader shift away from weaker smart mobile demand toward automotive, industrial, communications and AI applications, though it does not immediately change the near term risk that higher investment and oversubscribed niches like SiGe could still coexist with only high 80s percent fab utilization. Among recent announcements, a US$2 billion, five year silicon interposer deal with TSMC reinforces GlobalFoundries' role in AI hardware supply alongside FDX Fusion, with the Dresden FDX roadmap and Malta advanced packaging capacity sitting squarely against the key catalyst of moving its revenue mix toward higher value, AI linked processes. GlobalFoundries' narrative projects $10.4 billion revenue and $1.7 billion earnings by 2029, requiring 14.5% yearly revenue growth and a roughly $1.0 billion earnings increase from $716.0 million today, while the most optimistic analysts already assumed about US$11.7 billion of revenue and US$2.3 billion of earnings by 2029.
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Semiconductors › Foundry & Contract Fabrication Technology
Artificial Intelligence › Foundry & Advanced Packaging ▲Technology
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Semiconductors › Logic, Compute & Connectivity Processors Technology
GFS · Technology · Positive GlobalFoundries unveils FDX Fusion FD-SOI platform in Dresden for energy-efficient Physical AI chips, advancing its AI-linked product roadmap.
GFS · Demand · Positive $2 billion five-year silicon interposer deal with TSMC reinforces GlobalFoundries' role in AI hardware supply.
▲impact 4
TSMC Posts Record Q3 2026 Revenue on AI Chip Demand
Taiwan Semiconductor Manufacturing reported record Q3 2026 revenue of about NT$1.49t, with September alone at NT$511.86b, driven by demand for chips used in AI workloads. Management highlighted advanced packaging services for AI accelerators as a key contributor to the quarter, and said leading edge capacity is fully booked through 2026. TSMC also agreed a multi year, US$2b silicon interposer supply arrangement with GlobalFoundries that includes the first U.S.-based silicon interposer production for its packaging, extending its CoWoS packaging supply chain into the United States and spreading manufacturing risk. The company is supporting a US$64b capex plan, and investors will watch whether it can ease advanced packaging constraints and how much of that spend translates into stable utilization and revenue progress through and after the Malta ramp toward 2028.
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Artificial Intelligence › Foundry & Advanced Packaging ▲Supply
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Artificial Intelligence › AI Compute & Accelerator Silicon ▲Supply
Semiconductors › Advanced Packaging & Test (OSAT) ▲Supply
2330.TW · Capital · Positive TSMC is supporting a US$64b capex plan and investors are watching how that spend translates into utilization and revenue.
2330.TW · Demand · Positive TSMC posted record Q3 2026 revenue on AI chip demand, with leading-edge capacity fully booked through 2026.
GFS · Demand · Positive GlobalFoundries agreed a multi-year US$2b silicon interposer supply arrangement with TSMC, including first U.S.-based silicon interposer production.
BOE Technology Responds: Mass Production of Glass-Based Packaging Substrates Requires New Production Line Investment
BOE Technology stated on its investor interaction platform on October 10, in response to investor questions, that if the company's glass-based packaging substrate business reaches the conditions for a mass production decision, it will need to invest in building a new mass production line. Previously, investors had asked BOE Technology whether achieving mass production would require investing in a new production line, given that the company's glass substrates have already passed testing by multiple customers.
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Artificial Intelligence › Foundry & Advanced Packaging Supply
Semiconductors › Advanced Packaging & Test (OSAT) Supply
000725.CS · Capital · Neutral BOE says mass production of glass-based packaging substrates would require investing in a new production line, a capex decision contingent on future conditions.
impact 4
Musk's Terafab to Begin Mass Production in Texas by 2032
Plans emerged on the 9th that Terafab, the semiconductor manufacturing initiative launched by American businessman Elon Musk, aims to have a large-scale mass production plant operating in Texas by 2032. According to people familiar with the matter, preparations are underway to start up a semiconductor pilot plant in the state during 2027, and orders have already begun to be placed with Japanese semiconductor manufacturing equipment and materials companies for the pilot plant. The plant is expected to be completed as early as July 2027 and to begin operating within that year. At the large-scale mass production plant targeted for operation in 2032, production of logic semiconductors capable of advanced computing and memory will be handled at a single facility, with final production scale projected at roughly 1 million wafers per month, of which about 70 percent of capacity will be allocated to memory and about 30 percent to logic. The production scale will be comparable to the large-scale plants of major semiconductor makers such as Taiwan Semiconductor Manufacturing and South Korea's Samsung Electronics. For logic semiconductor production, Intel of the United States will provide technical cooperation, with adjustments underway to adopt the company's 2-nanometer and 1.4-nanometer circuit linewidth technologies, while for memory manufacturing a plan has surfaced for a Taiwanese company to provide technical cooperation. Terafab is an initiative announced by Musk in March, under which the electric vehicle giant Tesla and space development company SpaceX will lead the development of semiconductor plants, investing 55 billion dollars initially, with total investment potentially expanding to 119 billion dollars including additional portions.
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Semiconductors › Memory — DRAM, NAND & HBM Supply
Artificial Intelligence › Foundry & Advanced Packaging Supply
SPCX · Capital · Positive SpaceX is named as co-lead of the Terafab semiconductor initiative, which involves $55B initial and up to $119B total investment.
TSLA · Capital · Positive Tesla is named as co-lead of the Terafab semiconductor initiative, which involves $55B initial and up to $119B total investment.
INTC · Technology · Positive Intel will provide technical cooperation for Terafab's logic production, with its 2nm and 1.4nm technologies to be adopted.
005930.KO · Competition · Neutral Samsung is only cited as a comparison for Terafab's planned production scale, not as a participant.
2330.TW · Competition · Neutral TSMC is only cited as a comparison for Terafab's planned production scale, not as a participant.